Title: Positive type photosensitive resin composition and semiconductor device using the same
Application Number: 97111184 Application Date: 1997.05.12
Publication Number: 1165980 Publication Date: 1997.11.26
Approval Pub. Date: 2003.07.02 Granted Pub. Date: 2003.07.02
International Classifi-cation: G03F7/022;H01L21/027
Applicant(s) Name: Sumicomo Bakelite Co., Ltd. Address:
Inventor(s) Name: Takashi Hirano;Toshio Banba;HiroakiMakabe
Attorney & Agent: CHEN JIZHUANG
Abstract:
    A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1), (B) 1 to 100 parts by weight of a photosensitive diazoquinone compound and (C) 1 to 50 parts by weight of a phenol compound represented by a specific structural formula and/or (D) 0.1 to 20 parts by weight of an organosilicon compound represented by a specific structural formula; wherein each substitute is defined in the specification. Moreover a semiconductor device in which a pattern of a polybenzoxazole resin obtained by using the above photosensitive resin composition is formed in a thickness of 0.1 to 20 mu m on a semiconductor element.
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