Title: Soldering resist compsn. and printed wiring board
Application Number: 200410031919 Application Date: 1997.09.18
Publication Number: 1541051 Publication Date: 2004.10.27
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: B23K35/362,G03F7/038,H05K3/22
Applicant(s) Name: Ibiden Co., Ltd. Address:
Inventor(s) Name: Ono Yoshitaka, Goto Akihiko
Attorney & Agent: du rixin
Abstract:
     A solder resist composition comprises an acrylate of novolac type epoxy resin and an imidazole curing agent and has a viscosity of 0.5-10 Ps.s adjusted with glycol ether type solvent. A printed circuit board is formed by using such a solder resist composition.
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