Title: Aligner and method for exposure
Application Number: 97181117 Application Date: 1997.11.28
Publication Number: 1242104 Publication Date: 2000.01.19
Approval Pub. Date: 2004.03.31 Granted Pub. Date: 2004.03.31
International Classifi-cation: G03F7/20;H01L21/027
Applicant(s) Name: Nikon Corporation Address:
Inventor(s) Name: Nishi Kenji;Ota Kazuya
Attorney & Agent: wang yonggang
Abstract:
    Two stages WS1, WS2, each of which supports a wafer, can individually move between a position information measuring section PIS below an alignement system 24a and an exposure section EPS below a projection optical system PL. While a wafer is replaced and aligned on the stage WS1, a wafer W2 is exposed on the stage WS2. The position of a wafer W1 in each shot region on the stage WS1 is found, by the section PIS, as a relative position to a reference mark formed on the stage WS1. The information about the relative position is used for alignment in relation to an alignment pattern, when the stage WS1 moves to the section EPS and the wafer W1 is exposed. Therefore, the position of the stage need not be monitored continuously during movement. By parallel processing of exposures using the two wafer stages WS1, WS2, a throughput can be increased.
Time: 5
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