Title: Projection exposure apparatus
Application Number: 200610004900 Application Date: 1997.11.28
Publication Number: 1831652 Publication Date: 2006.09.13
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: G03F7/20,G03F9/00
Applicant(s) Name: Nippon Kogaku KK Address:
Inventor(s) Name: Nishi Kenji
Attorney & Agent: wang yonggang
Abstract:
     Two stages (WS1, WS2), each of which supports a wafer, can individually move between a position information measuring section (PIS) below an alignement system (24a) and an exposure section (EPS) below a projection optical system (PL). While a wafer is replaced and aligned on the stage (WS1), a wafer (W2) is exposed on the stage (WS2). The position of a wafer (W1) in each shot region on the stage (WS1) is found, by the section (PIS), as a relative position to a reference mark formed on the stage (WS1). The information about the relative position is used for alignment in relation to an alignment pattern, when the stage (WS1) moves to the section (EPS) and the wafer (W1) is exposed. Therefore, the position of the stage need not be monitored continuously during movement. By parallel processing of exposures using the two wafer stages (WS1, WS2), a throughput can be increased.
Time: 6
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