Title: Photoetching device and exposure method
Application Number: 01121643 Application Date: 1997.11.28
Publication Number: 1329287 Publication Date: 2002.01.02
Approval Pub. Date: 2006.03.01 Granted Pub. Date: 2006.03.01
International Classifi-cation: G03F7/20
Applicant(s) Name: Nikon Corp. Address:
Inventor(s) Name: Kawachi Kenji;Ota Kanuya
Attorney & Agent: wang yonggang
Abstract:
    Two stages WS1, WS2 holding wafers can independently move between a positional information measuring section PIS under an alignment system 24a and an exposing section EPS under a projection optical system PL. The wafer exchange and alignment are performed on the stage WS1, during which wafer W2 is exposed on the stage WS2. A position of each shot area of wafer WS1 is obtained as a relative position with respect to a reference mark formed on the stage WS1 in the section PIS. Relative positional information can be used for the alignment with respect to an exposure pattern when the wafer WS1 is moved to the section EPS to be exposed. Therefore, it is not necessary that a stage position is observed continuously in moving the stage. Exposure operations are performed in parallel by the two wafer stages WS1 and WS2 so as to improve the throughput.
Time: 13