Title: One-component optical-imagery liquid soldering inhibitor and its preparation
Application Number: 97120324 Application Date: 1997.12.08
Publication Number: 1184265 Publication Date: 1998.06.10
Approval Pub. Date: Granted Pub. Date: 2001.03.14
International Classifi-cation: G03F7/027,H05K3/28
Applicant(s) Name: Inst. of Photographic Chemistry, Chinese Academy o Address: 100101
Inventor(s) Name: Wang Erjian, Li Miaozhen
Attorney & Agent: li bai
Abstract:
     The soldering inhibitor for PC board painting includes compound photosensitive film resin 30-50 wt%, acrylate as coupling agent and active diluent 15-30 wt%, photosensitive initiator 2-6 wt%, filler and pigment 15-30%, assistant 1-6 wt% and solvent 10-20 wt%. The compound photosensitive film resin is compounded by using resin R1 with side chain containing unsaturated bond and hydrophilic group, resin R2 with backbone containing unsaturated bond and resin R3 with backbone containing unsaturated bond and side chain containing hydrophilic group. The soldering inhibitor is prepared by mixing above said components while stirring.
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