Title: Method and device using ArF photoresist
Application Number: 97126153 Application Date: 1997.12.31
Publication Number: 1187495 Publication Date: 1998.07.15
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: C08F18/24;C08F32/00;G03F7/00
Applicant(s) Name: Hyundai Electronics Industries Co., Ltd. Address:
Inventor(s) Name: Jae-chang Jung;Cheol-kyu Bok;Ki-ho Baik
Attorney & Agent: ding yebeng
Abstract:
    A photoresist includes a copolymer of one or more bicycloalkene derivatives with maleic anhydride and/or vinylene carbonate, and has a molecular weight of 3000 to 100,000. The photoresist can be used for submicrolithography employing deep ultra violety as a light source. In addition to being of high etch resistance and thermal resistance, the photoresist has good adhesiveness and can be developed in a TMAH solution.
Time: 5