Title: Electroconductive copper paste composition
Application Number: 98106191 Application Date: 1998.01.26
Publication Number: 1195001 Publication Date: 1998.10.07
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: C08K3/08;C08L61/06;G03F7/12
Applicant(s) Name: Sumitomo Bakelite Co., Ltd. Address:
Inventor(s) Name: Omiya Tanijuro;Takahashi Yoshiyuki
Attorney & Agent: huang zexiong
Abstract:
    An electroconductive copper paste composition comprising a copper powder, a thermosetting resin and a solvent as essential components, characterized in that the copper powder has a dendrite shape having an average particle diameter of 1 to 25 mu m and a BET specific surface area of 2,000 to 6,300 cm
Time: 9
<- Previous Patent:Drawing producing method   |  Next Patent:Photocurable resin composition ->