Title: Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system
Application Number: 00806652 Application Date: 2000.03.21
Publication Number: 1348552 Publication Date: 2002.05.08
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: G03D5/00;H01L21/31
Applicant(s) Name: Silicon Valley Group, Thermal Systems LLC Address:
Inventor(s) Name: Richard.N. Savage;Frank.S. Menagh;Helder.R. Carval
Attorney & Agent: luo echuan
Abstract:
    A semiconductor wafer processing system including a multi-chamber module having vertically-stacked semiconductor wafer process chambers and a loadlock chamber dedicated to each semiconductor wafer process chamber. Each process chamber includes a chuck for holding a wafer during wafer processing. The multi-chamber modules may be oriented in a linear array. The system further includes an apparatus having a dual-wafer single-axis transfer arm including a monolithic arm pivotally mounted within said loadlock chamber about a single pivot axis. The apparatus is adapted to carry two wafers, one unprocessed and one processed, simultaneously between the loadlock chamber and the process chamber. A method utilizing the disclosed system is also provided.
Time: 6
<- Previous Patent:Liquid sprayer   |  Next Patent:film feeder ->