Title: Phase shift photomask and method for improving printability of a structure on a wafer
Application Number: 200480040252 Application Date: 2004.11.17
Publication Number: 1902468 Publication Date: 2007.01.24
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: G01F9/00;G03F9/00;G03C5/00
Applicant(s) Name: Dupont Photomasks Inc. Address:
Inventor(s) Name: Nakagawa Kent
Attorney & Agent: yang kai liang yong
Abstract:
    A phase shift photomask and method for improving printability of a structure on a wafer are disclosed. The method includes providing a photomask including a zero degree PSW formed on a top surface of a substrate and a 180 degree PSW formed in a first region of the substrate. An orthogonal PSW that facilitates projection of an increased intensity of radiant energy through a second region of the substrate during a lithography process is formed in the second region between the zero degree PSW and the 180 degree PSW.
Time: 11