Title: Active device assembly
Application Number: 00817668 Application Date: 2000.12.14
Publication Number: 1433527 Publication Date: 2003.07.30
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: G02F1/03;G02F1/035;G02F1/225;G02F1/313
Applicant(s) Name: Corning Optical Technologies Italia S.P.A Address:
Inventor(s) Name: M.A. Shaw;M. Marazzi;D. Sciancalepore
Attorney & Agent: shen zhaokun
Abstract:
    Active device assembly comprises a substrate having at least a planar surface on which a plurality of electrical contact pads are formed, a chip having a surface on which at least one optical waveguide and a plurality of electrodes are formed. Said chip surface is in a facing relationship with the planar surface of the substrate, and said electrical contact pads are in electrical contact to said electrodes. Said contact pads and said electrodes provide mechanical connection between said chip and said substrate and the coefficient of thermal expansion of the substrate is greater than or equal to the coefficient of thermal expansion of the chip in a length direction.
Time: 7
<- Previous Patent:Sealing agent for liquid-crystal ...   |  Next Patent:Display device ->