Title: Integrated circuit and method for controlling the temperature of a semiconductor material having an integrated circuit
Application Number: 200610166972 Application Date: 2006.12.15
Publication Number: 1988153 Publication Date: 2007.06.27
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H01L27/02;H01L23/34;H01L25/18;G01T1/24
Applicant(s) Name: Siemens AG Address:
Inventor(s) Name: Heismann Bjorn;Winkelmann Helmut
Attorney & Agent: houyu taofeng bei
Abstract:
    A circuit is disclosed, integrated in a semiconductor material, for measuring signals of a sensor assigned to the integrated circuit. In at least one embodiment, the circuit includes an active component; a temperature sensor; and a circuit to control the temperature of the semiconductor material. The active component is provided to treat the measuring signals produced by the sensor and the active component is drivable by the circuit to control the temperature in such a way that the temperature of the semiconductor material is variable. A method for controlling the temperature of a semiconductor material that has an integrated circuit is further disclosed.
Time: 7