Title: Modular, semiconductor reliability test system
Application Number: 97198612 Application Date: 1997.10.06
Publication Number: 1232546 Publication Date: 1999.10.20
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: G01R31/316
Applicant(s) Name: Aetrium Inc. Address:
Inventor(s) Name: Venu Turlapaty;Brent Harry;Timothy McMullen
Attorney & Agent: liu xiaofeng
Abstract:
    A system (10) for performing semiconductor reliability tests is disclosed including an oven (36) having open axial ends for slideably receiving a board (12). The board (12) includes an oven region (16) which is removably received in the oven (36) and which is located intermediate connection and exterior regions (14, 18) located axially outside of the oven (36). A temperature sensor (30) is positioned in the oven region (16) and its calibration device (32) is located in the exterior region (18). Contacts (34) on the axial free edge of the connection region (14) are slideably received in an electrical connector (72). The board (12) is formed of low heat transfer material so that the connection and exterior regions (14, 18) and the electrical connector (72) is not heated by the oven (36) and includes a handle (22) on the axial free edge of the exterior region (18). The heat transfer element (38) of the oven (36) has a large thermal mass and is in close and uniform proximity to the DUTs (28) received on the board (12).
Time: 19