Title: Gas flow measuring apparatus
Application Number: 200610105437 Application Date: 2006.07.05
Publication Number: 1896697 Publication Date: 2007.01.17
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: G01F1/68;F02D35/00;G01P5/12;H01L37/00;H01L23/40
Applicant(s) Name: Hitachi Ltd. Address:
Inventor(s) Name: Hanzawa Keiji;Shimada Satoshi;Yasukawa Akio;Saito
Attorney & Agent: li guiliang
Abstract:
    To realize a gas flow rate measuring arrangement capable of suppressing the characteristic variation such as sensitivity, response by reducing stress transmission to a resister on a diaphragm without accompanying cost rise. The substrate around a diaphragm (10) is loaded with fixed resisters (3, 4) and a resistance thermometer bulb (5). These resisters are connected with exterior by terminals (12 ~ 24). To mitigate the stress transmission from a section the terminals (12 ~ 24) are arranged to the diaphragm (10), a groove (11) of U-shape is formed for length (Xd2) around the diaphragm (10). The groove (11) is formed of a horizontal groove 11a and two vertical grooves (11b, 11c). The region where the terminals (12 ~ 24) of the detection element 1 are formed and a region where the diaphragm (10) is formed are sectioned with the horizontal groove (11a) and the region where the terminals (12 ~ 24) are formed becomes a fixed part. The bottom of the fixed part is fixed to the substrate with adhesive bond and the actual stress to be transmitted to the region where the diaphragm (10) is formed is absorbed by the stress mitigating groove (11a).
Time: 5
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