Title: Semiconductor device
Application Number: 200610154051 Application Date: 2006.09.20
Publication Number: 1940571 Publication Date: 2007.04.04
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: G01P15/08
Applicant(s) Name: Oki Electric Ind Co., Ltd. Address:
Inventor(s) Name:
Attorney & Agent: wangsi beng
Abstract:
    The invention provides a semiconductor device which reduces the generation of a stress due to a difference between the thermal expansion coefficients of a package and a semiconductor element, and which is capable of being stably operated against deformation due to the external stress or thermal expansion of the package for receiving the semiconductor element. The semiconductor device 100 is provided with the package (a lower vessel 101, a spacer 111 and an upper lid 112) having cavities (101a, 101b) therein, a terminal 102 projected out of either one surface of the cavities (101a, 101b), and a semiconductor acceleration sensor chip 10 fixed to the terminal 102 so as not to be contacted with any surface of the cavities (101a, 101b).
Time: 10
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