Title: Semiconductor test device
Application Number: 200610098421 Application Date: 2006.07.04
Publication Number: 1892244 Publication Date: 2007.01.10
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: G01R31/26;G01R31/00;G01K7/00;H01L21/66
Applicant(s) Name: Matsushita Electric Ind Co., Ltd. Address:
Inventor(s) Name: Miyake Naomi;Sanada Minoru
Attorney & Agent: wang qi wang chenghua
Abstract:
    A semiconductor test device comprises a substrate having a opposed-wafer surface on which a semiconductor wafer with a plurality of the embedded semiconductor devices is placing opposite when a burn-in test is implemented, a wiring layer provided on the substrate, and a temperature sensor for measuring a temperature of the semiconductor wafer in the state here the semiconductor wafer is placing opposite on the substrate, wherein the wiring layer includes a wiring which is connected to the semiconductor wafer in the state where the semiconductor wafer is placing opposite on the substrate, and supplies a signal and a voltage for the burn-in test to the semiconductor wafer, and the temperature sensor is provided on the substrate in vicinity of the opposed-wafer surface.
Time: 9
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