Title: Junction temperature prediction method and apparatus for use in a power conversion module
Application Number: 200610142309 Application Date: 2006.09.27
Publication Number: 1952631 Publication Date: 2007.04.25
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: G01K7/16;G01K7/22;G01R31/27;G01R31/28;H02M1/00
Applicant(s) Name: Rockwell Automation Tech Inc. Address:
Inventor(s) Name: Kerkman Russel J.;Wei Lixiang;Lukaszewski Richard
Attorney & Agent: chenbin
Abstract:
    A method and apparatus for predicting junction device temperature of at least a first switching device in a power conversion module that includes the first switching device and at least a second switching device, the method comprising the steps of identifying a cross thermal impedance value indicative of how the temperature of the second switching device effects the first switching device temperature an using the cross thermal impedance value to predict the temperature of the at least a first switching device.
Time: 6